Nanotechnology Engineering

ALESSIO BUZZIN

GENERAL GOALS
The course intends to provide to the student the tools for the understanding, the analysis of the working principles, the manufacturing technologies, and the performance of
microelectromechanical systems (MEMS).
SPECIFIC GOALS
The student acquires knowledge related to miniaturization strategies of microelectromechanical systems, the impact on geometries and physics, the technological solutions for its fabrication.
Examples will be provided, for different categories, from first prototypes to state-of-the-art systems, from ideas in scientific papers to solutions on the market. Materials, working principles, fabrication and packaging strategies will be examined for various devices currently employed in daily life.
• Knowledge and understanding: Thorough knowledge of the main systems built with microelectromechanical components, with reference to the physical principles of operation of the single components and the manufacturing techniques.
• Applying knowledge and understanding: Capability to analyse and compare the state-of-the-art microelectromechanical systems design and their use in diverse modern-day applications.
• Making judgements: Ability to choose, compare and design state-of-the-art microelectromechanical systems.
• Communication skills: ability to describe, analyse and compare state-of-the-art microelectromechanical systems.
• Learning skills: leaning abilities suitable for working environments where design, prototyping and performance analysis of microelectromechanical systems take place.

The students acquire knowledge related to the miniaturization of electromechanical systems and components, the physical phenomena involved, design strategies, and material selection.
The student learns about the state-of-the-art fabrication strategies for microelectromechanical systems and their evolution over time, with reference to material selection and processing, interconnection, and packaging technologies. This knowledge is acquired starting from the current standards for the fabrication, interconnection, and packaging of integrated circuits and microchips.
The student learns about the operating principles, fabrication strategies, and performance of the most widely used microelectromechanical systems currently on the market, gaining the ability to compare them and develop a critical eye regarding the strengths, weaknesses, costs, and reliability of modern microsensors and microactuators.
Laboratory experiences and seminars help complete the training, with the goal of assisting the student in engaging with academic, technological, and industrial environments.

Basic knowledge of the English language and analytical / synthetic reasoning skills.

INTRODUCTION: definition of MEMS, overview of main applications on the market and in literature.
SCALING: definition, mechanisms, consequences on the physics of a device (electrostatic forces, electromagnetic forces, heat conduction, electric forces, fluid mechanics, chemical reactions). Examples of scaling of microelectronic devices. Examples of scaling of electromechanical devices.
TECHNOLOGIES: Overview on CMOS fabrication technologies. Comparison with MEMS technologies. Insight on thin/thick film deposition technologies (PVD, CVD), geometry definition (lithography), materials patterning (wet/dry etching). Overview of vacuum technologies: definitions, classifications and examples.
MATERIALS: overview on MEMS materials (mechanical, thermal, electrical, magnetic, optical and chemical properties), implementation (market, scientific literature).
INTERCONNECTIONS - PACKAGING: MEMS packaging and interconnection with integrated circuits and external environment.
MEMS DEVICES: working principle, structure and fabrication process flow of MEMS devices currently on the market (digital micromirror, microbolometer, inkjet printhead, inertial sensors).
LABORATORY EXPERIENCES: live demonstration of fabrication processes: thin-film deposition (PVD, CVD), lithography, thin-film patterning (wet/dry etching).

- M Gad-el-Hak, “The MEMS Handbook”, ASME 2002.
- K.E. Petersen, “Silicon as a Mechanical Material”, IEEE 1982.
- T. Hsu, “MEMS and Microsystems: Design, Manufacture, and Nanoscale Engineering”, Wiley, 2008.
- Y. C. Lee, “MEMS Packaging”, World Scientific Publishing, 2018.
- R. J. Shul and S. J. Pearton, “Handbook of advanced plasma processing techniques”, Springer, 2000.
- T. K. Gupta, “Handbook of Thick- and Thin-Film Hybrid Microelectronics”, Wiley, 2003.
- P. Walker and W. E. Tarn, “Handbook of Metal etchants”, CRC, 1991.
- S. Chakraborty, “Mechanics over Micro and Nano Scales”, Springer, 2011.
- Slides and course material provided by the teacher.

- M Gad-el-Hak, “The MEMS Handbook”, ASME 2002.
- K.E. Petersen, “Silicon as a Mechanical Material”, IEEE 1982.
- T. Hsu, “MEMS and Microsystems: Design, Manufacture, and Nanoscale Engineering”, Wiley, 2008.
- Y. C. Lee, “MEMS Packaging”, World Scientific Publishing, 2018.
- R. J. Shul and S. J. Pearton, “Handbook of advanced plasma processing techniques”, Springer, 2000.
- T. K. Gupta, “Handbook of Thick- and Thin-Film Hybrid Microelectronics”, Wiley, 2003.
- P. Walker and W. E. Tarn, “Handbook of Metal etchants”, CRC, 1991.
- S. Chakraborty, “Mechanics over Micro and Nano Scales”, Springer, 2011.
- Slides and course material provided by the teacher.

MICROELECTROMECHANICAL SYSTEMS course is held through classroom lectures with support of projections of teaching material and explanations with the help of the blackboard on the course topics reported in the teaching program. Every topic is theoretically explained, and then examples of components/systems/devices/technologies/applications related to that topic implemented in the market and in scientific literature are illustrated.

The Course has a site on the Sapienza Moodle e-learning platform through which students can have access to teaching material prepared by the teacher, to course information and to a communication Forum.
The Course is made of frontal teaching activities, individual study of the theory, strengthen by some laboratory exercises.
- Course attendance: optional but strongly recommended.
- Course delivery: lectures, exercises and laboratory.
- Use of Sapienza e-learning Moodle platform for distribution of teaching material and scientific papers.

Classroom attendance is optional but strongly recommended.

Oral examination

How does an electrostatic system behave when miniaturized?

What is the approach behind the fabrication of interdigitated electrodes for MEMS transducers?

What is a MEMS accelerometer, how does it work, and how is it made?

• Introduzione ai MEMS: cenni storici; evoluzione e miniaturizzazione; esempi e applicazioni moderne; sfide, caratteristiche e applicazioni attuali.
  • Books: Scientific papers, slides and books provided by the teacher about MEMS history and evolution, current challenges and applications.


• Il concetto di miniaturizzazione nei sistemi MEMS: fenomeni fisici, materiali, tecnologie.
  • Books: Scientific papers, slides and books provided by the teacher about MEMS scaling


• Tecnologie nei sistemi MEMS: strategie di fabbricazione, tecniche di lavorazione dei materiali e substrati, impianti e strumenti per la realizzazione di dispositivi.
  • Books: Scientific papers, slides and books provided by the teacher about MEMS technologies.


• Materiali nei MEMS: caratteristiche tecniche, vantaggi, sfide, strategie di implementazione.
  • Books: Scientific papers, slides and books provided by the teacher about MEMS materials and substrates.


• Packaging di sistemi MEMS: strategie, materiali e tecnologie, esempi pratici.
  • Books: Scientific papers, slides and books provided by the teacher about MEMS packaging.


• Dispositivi MEMS: analisi dei dispositivi MEMS più diffusi attualmente sul mercato, principi di funzionamento, tecnologie di realizzazione, materiali e packaging.
  • Books: Scientific papers, slides and books provided by the teacher about modern MEMS systems studied in class, working principle, technologies and applications.